Henkel to Launch New Materials and Adhesive Solutions for 3D Printing

For the first time ever Henkel will be present at the Formnext in Frankfurt. The company will showcase its growing solution portfolio for end-to-end-processes. Visitors among others can experience the market launch of differentiated new resin platforms as well as the first tailor-made adhesives for post-processing under the well-known Loctite brand.

 Differentiated resin platforms

Henkel will launch differentiated new engineering resin platforms during the Formnext 2018: General Purpose, Flexible, High Temperature, Durable High Impact, Ultra Clear and Silicone Elastomeric. The next-generation materials are designed to enable and optimize 3D Printing and manufacturing processes according to required functionalities and designs.

As an enabler for the resins, Henkel will also introduce its new Loctite 3D Printer and equipment for functional prototyping applications at an entry-level. For small-run production and industrial manufacturing of final parts the company is collaborating with various technology leaders such as HP Inc. and others.

 New General Bonding Kit

Henkel will also launch its first General Bonding Kit for 3D Printing applications. The kit consists of Loctite 3D Printing Universal Bonder and the Loctite 3D Printing Instant Bonder as well as activators, primers and cleaning products. The kit aims to easily support customers in bonding prototyping parts for the most-known 3D Printing technologies. In addition, Henkel offers bonding solutions for the industrial series production of 3D printed parts. The company also plans to set-up bonding trainings for industrial users via tutorials and webinars soon.

Visitors can experience the entire solution portfolio from November 13-16 in hall 3.1, booth H59.

Source: Henkel