Osseus Fusion Systems Has Officially Announced the Alpha Launch Of 3D Printed Aries-TS
Osseus Fusion Systems announced the official Alpha Launch of Aries™-TS, its 3D printed transforaminal lumbar interbody fusion device.
“In January, we celebrated the one-year anniversary of the first implantation of the Aries™-L lateral lumbar interbody fusion device so we are very excited to follow it up with the launch of the Aries™-TS. As a company committed to helping those in need of relief from chronic lumbar pain, we are confident that the Aries™ family of lumbar interbodies is a positive step toward that goal.” – Robert Pace, CEO of Osseus Fusion Systems
Image via Osseus Fusion Systems
Aries™ devices are constructed from highly porous titanium material, which is optimized for bone fusion and biological fixation using PL3XUS, Osseus’ innovative and proprietary 3D-printing technology. PL3XUS titanium technology utilizes powder bed fusion, specifically Selective Laser Melting (SLM), to create 80% porous implants with increased bone graft packability and lower stiffness compared to competitive devices on the market. Aries™ implants are manufactured in 30-micron layers of titanium powder and sintered in solid, porous parts, in sequential layers. The Aries™ implants then undergo a rigorous, proprietary post-processing cycle to optimize the device for clinical outcomes.
The Aries™ family of lumbar interbody fusion devices features a proprietary mesh lattice structure, which helps reduce the stiffness of the cage and maximize bone graft packability. The distinctive mesh structure is optimized to create a superior environment for bone cell fixation and proliferation. Each Aries™ lumbar interbody fusion device comes in a wide variety of footprints, heights, and lordotic angles, to adapt to a variety of patient anatomies.
The system is intended for intervertebral body fusion procedures in skeletally mature patients with degenerative disc disease (DDD) of the lumbar spine at one or two contiguous levels from L2 to S1. It also offers aid to Grade 1 spondylolisthesis or retrolisthesis at the involved level(s).
The next interbody to hit the market will be their Aries™-TC Transforaminal Curved Interbody.