Solvay Expands Ecosystem of 3D-printing Solutions with Simulation Software Support from e-Xstream Engineering
April 25, 2018 , Solvay annouced that their high-performance KetaSpire® PEEK AM filament will be the first polyetheretherketone polymer included in e-Xstream engineering’s Digimat® simulation software due for launch in June 2018. “KetaSpire® PEEK’s...
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